Solutions
JTU
SN-330
- Solder paste management
- All-in-one fully automatic system (Refrigeration, thawing & stirring)
- Intelligent inventory management system
- Full automation with controlled solder paste quality
- Maintain optimum conditions for solder paste storage
- Error-proof operations
- Full traceability and reliability
- First-In-First-Out (FIFO) mechanism
- Industry 4.0 ready
| Dimension | L1,860 x W1,490 x H1,950 mm |
| Weight | 1550 kg |
| Storage/Refrigeration capacity | 330 Jars |
| Thawing capacity | 55 Jars |
| Applicable solder paste packaging | 500g Jar |
| Feeding quantity | Max. 28 Jars at once |
| Refrigeration temperature | 1 - 10°C (Uniformity ±3°C) |
| Thawing temperature | 18 - 28°C (Room temperature) |
| Stirring capacity | Half jar, 1 jar or 2 jars simultaneously |