Solutions
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GKG
G-Tera
- Fully automatic solder paste printer
- Auto paste dispensing system eliminates wastage of solder paste overflowing to the sides of squeegee
- Paste roll diameter monitoring system keeps the paste rolling in optimum range to achieve best printing result
- Unique design PCB clamper and stencil lock ensures good printing result
- Stencil aperture inspection automatically detects clogging on stencils, eliminates poor printing from the beginning
- IPA dispensing nozzle and 3 cleaning modes available for effective stencil cleaning
- Solvent tank with weighing scale to monitor solvent volume in real time
| Process Alignment Capability | 2 Cpk @ ± 15 microns 6 sigma |
| Machine Alignment Capability | 2 Cmk @ ± 8 microns 6 sigma |
| Core Cycle Time | 7.5 secs (Excluding printing & cleaning) |
| Product Changeover time | 2 mins |
| New Product Set up time | 4 mins |
| Max. Board Size (L x W) | 510 x 510 mm |
| Min. Board Size (L x W) | 50 x 50 mm |
| Board Thickness | 0.2 - 6.0 mm |